agilent hlmp-ce15, hlmp-ce16, hlmp-ce23, hlmp-ce24, hlmp-ce30, hlmp-ce31 t-1 3/4 (5 mm) precision optical performance ingan bluish- green led lamps data sheet features ? ? ? ? ? smooth, consistent spatial radiation patterns ? ? ? ? ? high luminous output ? ? ? ? ? viewing angles 15 , 23 , , , , , and 30 ? ? ? ? ? superior resistance to moisture benefits ? ? ? ? ? viewing angles match traffic signal requirements ? ? ? ? ? superior performance in outdoor environments ? ? ? ? ? suitable for autoinsertion onto pc boards applications ? ? ? ? ? traffic signals ? ? ? ? ? railroad signals ? ? ? ? ? commercial outdoor signs ? ? ? ? ? automotive interior lights description these high intensity bluish- green leds are based on ingan material technology. ingan is the most efficient and cost effective material for leds in the blue and green region of the spectrum. the 505 nm typical dominant wavelength matches international specifications for green traffic signals. these led lamps are untinted, nondiffused, t-1 3/4 packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. these lamps are made with an advanced optical grade epoxy, offering superior temperature and moisture resistance in outdoor signal and sign applications. the package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. these lamps are available in three viewing angle options and two package options to give the designer flexibility with optical design and device mounting. caution: hlmp-cexx leds are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to agilent application note an-1142 for additional details.
2 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. the optical axis is closely aligned with the package mechanical axis. 3. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 4. all ingan leds represented here are iec825 class 2. see application brief 1-009 and 1-015 for details. 5. tolerance for intensity limit is 15%. part number color and dominant wavelength d ty p . ( n m ) viewing angle 2 1/2 ty p. (d e g) luminous intensity lv (mcd) at 20 ma standoff min. max. hlmp-ce15-wzcxx 505 15 5500 16000 no hlmp-ce15-wzqxx 505 15 5500 16000 no hlmp-ce16-uxqxx 505 15 3200 9300 yes hlmp-ce16-wzcxx 505 15 5500 16000 yes hlmp-ce16-wzqxx 505 15 5500 16000 yes hlmp-ce23-uvqxx 505 23 3200 5500 no hlmp-ce23-uxcxx 505 23 3200 9300 no hlmp-ce23-uxqxx 505 23 3200 9300 no hlmp-ce23-vwqxx 505 23 4200 7200 no hlmp-ce24-uxcxx 505 23 3200 9300 yes hlmp-ce24-uxqxx 505 23 3200 9300 yes hlmp-ce30-rscxx 505 30 1500 2500 no hlmp-ce30-svcxx 505 30 1900 5500 no hlmp-ce30-svqxx 505 30 1900 5500 no hlmp-ce31-svcxx 505 30 1900 5500 yes hlmp-ce31-svqxx 505 30 1900 5500 yes device selection guide
3 package dimensions notes: 1. dimensions in mm. 2. tolerance 0.1 mm unless otherwise noted. 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat hlmp-ce15, hlmp-ce23, and hlmp-ce30 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat d 1.50 0.15 (0.059 0.006) hlmp-ce16, hlmp-ce24, and hlmp-ce31 hlmp-ce24 hlmp-ce31 d = 12.40 0.25 (0.488 0.010) d = 12.22 0.50 (0.481 0.020) hlmp-ce16 d = 12.6 0.18 (0.496 0.007) part numbering system hlmp - x x x x - x x x x x mechanical options 00: bulk packaging dd: ammo pack color bin selections c: color bins 3 and 4 only q: color bins 7 and 8 only maximum intensity bin 0: no iv bin limitation minimum intensity bin viewing angle and stand-off 15: 15 deg, without stand-off 16: 15 deg, with stand-off 23: 23 deg, without stand-off 24: 23 deg, with stand-off 30: 30 deg, without stand-off 31: 30 deg, with stand-off color e: 505 nm bluish-green package c: 5 mm ingan
4 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the perceived color of the device. 2. the radiant intensity, le in watts per steradian, may be found from the equation le = iv/ v, where iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. electrical/optical characteristics at t a = 25c parameter symbol min. typ. max. units test conditions forward voltage v f 3.8 4.0 v i f = 20 ma reverse voltage v r 10 i r = 100 a capacitance c 40 pf v f = 0, f = 1 mhz thermal resistance r j-pin 240 c/w led junction-to-cathode lead dominant wavelength d 505 nm i f = 20 ma peak wavelength l peak 502 nm peak of wavelength of spectral distribution at i f = 20 ma spectral halfwidth ? 1/2 35 nm wavelength width at spectral distribution power point at i f = 20 ma luminous efficacy v 350 lm/w emitted luminous power/ emitted radiant power absolute maximum ratings at t a = 25 c note: 1. derate linearly as shown in figure 4 for temperatures above 50c. 2. duty factor 10%, 1khz parameter value units dc forward current [1] 30 ma peak forward current 100 ma power dissipation 120 mw reverse voltage (i r = 100 a) 5 v led junction temperature 130 c operating temperature range -40 to +80 c storage temperature range -40 to +100 c
5 figure 4. maximum forward current vs. ambient temperature. figure 5. color vs. forward current. figure 6. spatial radiation pattern ? 15 lamps. figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. relative luminous intensity vs. forward current. wavelength - nm relative intensity 400 600 1.0 0.6 0 550 500 450 0.4 0.8 0.2 i f - forward current - ma 2 0 v f - forward voltage - v 3.6 20 15 2.8 30 5 10 25 2.4 3.2 4.0 relative intensity (normalized at 20 ma) 0 0 forward current - ma 15 25 1.4 0.8 0.6 520 1.2 30 0.2 1.0 0.4 10 forward current - ma 0 0 ambient temperature - ?c 40 80 35 30 25 15 10 20 60 100 120 5 20 40 dominant wavelength e nm 0 498 forward current e ma 15 25 520 506 10 20 512 30 5 502 508 500 504 510 514 516 518 relative intensity 1.0 0 angle - degrees 0.5 -30 0 30 50 -50 10 -20 -10 20 -40 40 figure 7. spatial radiation pattern ? 23 lamps. figure 8. spatial radiation pattern ? 30 lamps. relative intensity 1.0 0 angle - degrees 0.5 -30 0 30 50 -50 10 -20 -10 20 -40 40 relative intensity 1.0 0 angle - degrees 0.5 -30 0 30 50 -50 10 -20 -10 20 -40 40
6 bin name min. max. n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 intensity bin limits (mcd at 20 ma) tolerance of each intensity bin limit is 15%. bin name min. max. 1 490 495 2 495 500 3 500 505 4 505 510 7 498 503 8 503 508 color bin limits (nm at 20 ma) tolerance for each color bin limit is 0.5 nm. note: bin categories are established for classification of products. products may not be available in all bin categories. please contact your agilent representative for information on currently available bins.
7 wave soldering manual solder dipping pre-heat temperature 105 c max. ? preheat time 30 sec max ? peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 solder: sn63; flux: rma 250 200 150 fluxing turbulent wave preheat time - seconds temperature - ?c 100 50 30 0 10 20 30 40 50 60 70 80 90 100 laminar wave hot air knife led component ead size diagonal plated through hole diameter 0.457 x 0.457mm (0.018 x 0.018inch) 0.646 mm (0.025 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 0.508 x 0.508mm (0.020 x 0.020inch) 0.718 mm (0.028 inch) 1.049 to 1.150mm (0.041 to 0.045 inch) precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. ? recommended soldering condition: recommended wave soldering profile note: refer to application note an1027 for more information on soldering led components. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. ? if necessary, use fixture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes size for led component leads.
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/inter- national), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2005 agilent technologies, inc. obsoletes 5989-3138en november 10, 2005 5989-4126en
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